IT3D-200S-BGA(39)

Hirose Connector
798-IT3D200SBGA39
IT3D-200S-BGA(39)

Ürt.:

Açıklama:
Karttan Karta ve Ara Kat Konnektörleri

ECAD Modeli:
Bu dosyayı ECAD Aracınız için dönüştürmek için ücretsiz Library Loader dosyasını indirin. ECAD Model hakkında daha fazla bilgi edinin.

Stok Durumu

Stok:
Stokta Yok
Fabrika Teslim Süresi:
Minimum: 1   Çoklu: 1
Birim Fiyat:
-,-- €
Toplam Fiyat:
-,-- €
Tahmini Gümrük Vergisi:

Fiyatlandırma (EUR)

Miktar Birim Fiyat
Toplam Fiyat
22,89 € 22,89 €
17,45 € 174,50 €
17,44 € 418,56 €
17,23 € 2.067,60 €
16,86 € 4.451,04 €
16,68 € 8.406,72 €

Ürün Niteliği Öznitelik Değeri Özellik Seçin
Hirose Electric
Ürün Kategorisi: Karttan Karta ve Ara Kat Konnektörleri
RoHS:  
Receptacles
200 Position
1.5 mm (0.059 in)
Solder Balls
Straight
39 mm
1 A
50 V
10 Gbps
- 55 C
+ 85 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
IT3
Tray
Marka: Hirose Connector
Montaj Ülkesi: Not Available
Dağıtım Ülkesi: Not Available
Menşe Ülke: MY
Ürün Tipi: Board to Board & Mezzanine Connectors
Fabrika Paket Miktarı: 24
Alt kategori:: Board to Board & Mezzanine Connectors
Parça No Takma Adları: 636-0003-8-39
Bulunan ürünler:
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Seçilen özellikler: 0

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USHTS:
8536694040

Medical Solutions

Hirose Electric Medical Solutions include high-performance connectors engineered for precision, durability, and reliability in demanding applications. Products offered include board-to-board, wire-to-board, FPC/FFC, circular, and coaxial connectors with IP67/IP68 sealing to protect against debris, dust, and moisture ingress. Features include EMI shielding, extended mating cycles, and secure locking, ensuring stable interference-free performance. The miniaturized products from Hirose support compact, high-density systems, while hybrid signal/power designs and RoHS/IEC compliance meet the evolving needs of diagnostic imaging, patient monitoring, therapy systems, and wearable medical tech.

IT3 High-Speed BGA Mezz Connectors

Hirose IT3 High-Speed BGA Mezz Connectors transmit differential, single-ended, and power through one package. The stackable IT3 series (ranging from 15mm to 40mm) provides reliable connections for today's data rates, including PCIe and XAUI, as well as 10+ Gbps systems. Hirose IT3 High-Speed BGA Mezz Connectors offer a staggered 1.5mm x 1.75mm ball grid array. Additional features include 100, 200, and 300 contacts (+90% additional grounds), low mating/extracting forces, wide misalignment tolerances for multiple connector use, and excellent reflow solderability. The IT3 system features three basic components: the mating receptacle, the interposer, and the mounting receptacle. The mating and mounting receptacles are reflowed to the PCB, and different height interposer assemblies are selected to achieve the needed height between the PCBs.