CYT3DLABZBQ1AESGSXQLA1

Infineon Technologies
726-ABZBQ1AESGSXQLA1
CYT3DLABZBQ1AESGSXQLA1

Ürt.:

Açıklama:
ARM Mikrodenetleyiciler - MCU TRAVEO-2 CLUST.2.5DGRAPH

Yaşam Döngüsü:
Yeni Ürün:
Bu üreticiden yeni.
ECAD Modeli:
Bu dosyayı ECAD Aracınız için dönüştürmek için ücretsiz Library Loader dosyasını indirin. ECAD Model hakkında daha fazla bilgi edinin.

Stokta Var: 100

Stok:
100 Hemen Gönderilebilir
Fabrika Teslim Süresi:
26 Hafta Gösterilenden daha büyük miktarlar için fabrikada tahmini üretim süresi.
Minimum: 1   Çoklu: 1
Birim Fiyat:
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Toplam Fiyat:
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Tahmini Gümrük Vergisi:

Fiyatlandırma (EUR)

Miktar Birim Fiyat
Toplam Fiyat
27,39 € 27,39 €
23,84 € 238,40 €
22,76 € 569,00 €
20,36 € 2.036,00 €
19,42 € 4.855,00 €
18,07 € 7.228,00 €
1.200 Fiyat Teklifi

Ürün Niteliği Öznitelik Değeri Özellik Seçin
Infineon
Ürün Kategorisi: ARM Mikrodenetleyiciler - MCU
RoHS:  
CYT3DL
SMD/SMT
TEQFP-216
ARM Cortex M0+, ARM Cortex M7
4.06 MB
32 bit
12 bit
100 MHz, 240 MHz
108 I/O
384 kB
2.7 V
5.5 V
- 40 C
+ 105 C
Tray
Marka: Infineon Technologies
Montaj Ülkesi: Not Available
Dağıtım Ülkesi: Not Available
Menşe Ülke: TW
Veri RAM Tipi: SRAM
Veri ROM Boyutu: 64 KB
Veri ROM Tipi: ROM
Arayüz Türü: CAN, I2C, SPI, UART
Neme Duyarlı: Yes
ADC Kanal Sayısı: 54 Channel
Zamanlayıcı/Sayaç Sayısı: 50 x 16 bit, 32 x 32 bit
İşletim Besleme Voltajı: 2.7 V to 5.5 V
İşlemci Serisi: CYT3DL
Ürün: Automotive MCUs
Ürün Tipi: ARM Microcontrollers - MCU
Program Bellek Türü: Flash
Fabrika Paket Miktarı: 400
Alt kategori:: Microcontrollers - MCU
Ticari Unvan: TRAVEO
Güvenlik Zamanlayıcısı: Watchdog Timer
Parça No Takma Adları: CYT3DLABZBQ1AESGS SP006066403
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Seçilen özellikler: 0

TARIC:
8542319000
ECCN:
5A992.C

CYT3DL TRAVEO™ T2G 32-Bit Otomotiv MCU'ları

Infineon Technologies CYT3DL TRAVEO™ T2G 32-Bit Automotive MCUs are dedicated to automotive systems such as instrument clusters and Head-Up Displays (HUD). The CYT3DL  MCUs feature a 2D graphics engine, sound processing, an Arm® Cortex®-M7 CPU running up to 240MHz for primary processing, and an Arm Cortex-M0+ CPU for peripheral/security processing. The MCUs include a WVGA GFX and are available in two unique packages: 216-pin TEQFP and 272-ball BGA. The Infineon TRAVEO T2G CYT3DL family products contain embedded peripherals supporting controller area networks with a flexible data rate (CAN FD), local interconnect networks (LIN), clock extension peripheral interfaces (CXPI), and Ethernet. The devices are manufactured using an advanced 40nm process. The CYT3DL TRAVEO T2G 32-Bit Automotive MCUs incorporate Infineon's low-power flash memory and multiple high-performance analog/digital peripherals and create a secure computing platform.

TRAVEO™ T2G Cluster

Infineon Technologies TRAVEO™ T2G Cluster MCUs are designed to offer extensive scalability and high performance for automotive applications. These MCUs are fortified with up to two Arm® Cortex®-M7 cores, each clocked at up to 320MHz, delivering a powerful 1500 DMIPS. They also feature impressive memory capacities, with up to 6MB of flash memory and 4MB of VRAM, ensuring ample storage and efficient data handling. Additionally, the TRAVEO™ T2G Cluster comes equipped with a 2.5D graphics engine, enabling advanced graphical displays and enhancing the overall user experience in automotive environments. High processing power, substantial memory, and advanced graphics capabilities make the TRAVEO T2G Cluster a robust solution for modern automotive systems.

32-bit TRAVEO™ T2G Arm® Cortex® Microcontrollers

Infineon Technologies 32-bit TRAVEO™ T2G Arm® Cortex® Microcontroller offers cutting-edge performance, safety, and security features for smart green mobility and safety-critical industry applications. These MCUs are built using single Arm® Cortex®-M4F and dual Cortex-M7F and have an enhanced performance of 1500DMIPS in the TRAVEO T2G Arm family. The TRAVEO automotive MCUs offer scalability across memory size and pin count. IP compatibility enables customers to design and develop systems using a single-platform MCU solution. These MCUs possess advanced security features like a Hardware Security Module (HSM), dedicated Cortex-M0+ for secure processing, and embedded flash in dual bank mode for Firmware Over-the-Air (FOTA) requirements.