1714505114

Molex
538-1714505114
1714505114

Ürt.:

Açıklama:
Karttan Karta ve Ara Kat Konnektörleri SpeedStack Vertical Receptacle, 0.80mm Pitch, 4.10mm Height, 82 Circuits, UL94V-0, Black

ECAD Modeli:
Bu dosyayı ECAD Aracınız için dönüştürmek için ücretsiz Library Loader dosyasını indirin. ECAD Model hakkında daha fazla bilgi edinin.

Stok Durumu

Stok:
Stokta Yok
Fabrika Teslim Süresi:
Minimum: 1800   Çoklu: 1800
Birim Fiyat:
-,-- €
Toplam Fiyat:
-,-- €
Tahmini Gümrük Vergisi:
Bu Ürün ÜCRETSİZ Gönderilir

Fiyatlandırma (EUR)

Miktar Birim Fiyat
Toplam Fiyat
10,45 € 18.810,00 €

Ürün Niteliği Öznitelik Değeri Özellik Seçin
Molex
Ürün Kategorisi: Karttan Karta ve Ara Kat Konnektörleri
171450
Marka: Molex
Ürün Tipi: Board to Board & Mezzanine Connectors
Fabrika Paket Miktarı: 1800
Alt kategori:: Board to Board & Mezzanine Connectors
Ticari Unvan: SpeedStack
Parça No Takma Adları: 171450-5114 01714505114
Bulunan ürünler:
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Seçilen özellikler: 0

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

SpeedStack Mezzanine Connector System

Molex SpeedStack Mezzanine Connector System offers a high-density, low-profile solution that delivers data rates up to 40Gbps per differential pair. With mated stack heights of 4mm to 10mm with a 0.80mm pitch, these connectors provide design flexibility for PCB space-constrained applications. The narrow housing design minimizes airflow obstructions and promotes system cooling. Molex SpeedStack Mezzanine Connector System utilizes a split-pad PCB design that allows for electrical tuning performance and provides edge card compatibility. The robust insert-molded wafer design with protected shrouded housing supports the terminal location to improve electrical balance within the signals for low-profile, high-density systems. In addition, a common grounding pin improves electrical performance and minimizes crosstalk. 

SpeedMezz Connector Family

Molex SpeedMezz Connector Family offers high densities, low profiles, data rates up to 56Gbps per differential pair. These products provide easy upgrading with common receptacle footprints. Molex SpeedMezz Connector Family delivers versatile solutions for high-speed mezzanine, rugged edge card, and lower speed applications.