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ELCON Micro Wire-to-Board Power Solutions

TE Connectivity's (TE) ELCON Micro Wire-to-Board Power Solutions offer a 12.5A maximum high current density per pin in the common industry footprint of 3mm (contact pitch). This common industry footprint provides designers and engineers with design flexibility through easy upgrades to existing designs. The ELCON Micro Wire-to-Board Solutions support 2 to 24 pin configurations and different currents with multiple combinations of different wire sizes. The 5mΩ low-contact resistance provides a lower temperature rise and lower power loss. Typical applications include servers, switch/routers, power supplies and distribution, gaming machines, printers, security systems, test and measurement equipment, Business Retail Equipment (BRE), refrigerators, and patient monitors.