Non-Silicone Liquid Thermal Gel

MG Chemicals Non-Silicone Liquid Thermal Gel is a 1-part gel that offers extreme thermal conductivity and flame retardancy. This gel is a form-in-place, non-curable substance that is easy to dispense and conforms to the component / heatsink interface, ensuring all air is displaced and eliminating hotspots. Because this gel does not cure, circuits can be powered up immediately following applications, offering exceptional convenience. MG Chemicals Non-Silicone Liquid Thermal Gel is often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components, and the high thermal conductivity makes it ideal for energy-intensive devices.