DK-CH101

TDK InvenSense
410-DK-CH101-01
DK-CH101

Ürt.:

Açıklama:
Mesafe Sensörü Geliştirme Aracı Chirp Developmnt Kit

Stokta Var: 9

Stok:
9 Hemen Gönderilebilir
Fabrika Teslim Süresi:
3 Hafta Gösterilenden daha büyük miktarlar için fabrikada tahmini üretim süresi.
Minimum: 1   Çoklu: 1
Birim Fiyat:
-,-- €
Toplam Fiyat:
-,-- €
Tahmini Gümrük Vergisi:
Bu Ürün ÜCRETSİZ Gönderilir

Fiyatlandırma (EUR)

Miktar Birim Fiyat
Toplam Fiyat
177,76 € 177,76 €

Ürün Niteliği Öznitelik Değeri Özellik Seçin
TDK
Ürün Kategorisi: Mesafe Sensörü Geliştirme Aracı
RoHS:  
Distance Sensor Development Tool
Development Kits
MEMS Ultrasonic ToF Sensor
CH-101
Marka: TDK InvenSense
Paketleme: Bulk
Fabrika Paket Miktarı: 1
Ticari Unvan: SmartSonic
Birim Ağırlık: 353,808 g
Bulunan ürünler:
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Seçilen özellikler: 0

CNHTS:
8543709990
CAHTS:
8473302000
USHTS:
8473301180
MXHTS:
8473300401
ECCN:
EAR99

DK-CH101 SmartSonic™ Platform

TDK InvenSense DK-CH101 SmartSonic™ Platform is a comprehensive development platform for CH-101, a miniature ultrasonic time-of-flight range sensor with a range of 4cm to 120cm. The development kit is equipped with an on-board CH-101 sensor, and up to four external MOD_CH101 sensor modules can be connected to the board via flat-flex cables for easy prototyping. Part of the SmartSonic platform, the DK-CH101 is designed around Atmel’s SAMG55 Cortex-M4 MCU, and can be used by developers for rapid evaluation and development of CH-101-based solutions. The DK-CH101 includes an on-board Embedded Debugger so external tools are not required to program or debug the SAMG55 MCU. The TDK InvenSense DK-CH101 SmartSonic Platform development kit comes with necessary software, including SonicLink, a GUI-based development tool, and embedded drivers for CH-101. SonicLink is a GUI-based development tool included with the platform. It can be used to capture and visualize the sensor data from the on-board CH-101 ultrasonic sensor and external MOD_CH101 sensor modules.

Chirp Products

TDK InvenSense Chirp Products are a family of miniature and ultra-low power ultrasonic Time-of-Flight (ToF) range sensors and modules based on MEMS technology. These sensors feature a system-in-package that integrates a Piezoelectric Micromachined Ultrasonic Transducer (PMUT) with an ultra-low-power System on Chip (SoC) in a miniature, reflowable package. The CH101 and the CH201 sensors can detect multiple objects, work in any lighting conditions, including full sunlight, and provide millimeter-accurate range measurements. The Chirp family products include ultrasonic sensor modules, development kits, and software, depending on the application requirements.