Renesas Electronics RF Entegre Devreler

Çip Üzerindeki RF Sistemi - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOsin FCGQFN24 and 0.4mm ball pitch package

Çip Üzerindeki RF Sistemi - SoC Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols

Çip Üzerindeki RF Sistemi - SoC 5.0 SoC w/ Flexpower ARM Cortex M0

RF Mikrodenetleyiciler - MCU MCU RA4 ARM CM4 48MHz 512k/96k QFN56

Çip Üzerindeki RF Sistemi - SoC BT5.0 QFN40 SoC

Çip Üzerindeki RF Sistemi - SoC Bluetooth Low Energy 4.2 SoC with Flexpower ARM Cortex M0, crypto, PMU, memories and peripherals - 16 GPIOs in WL-CSP53 package and 0.4mm ball pitch

Çip Üzerindeki RF Sistemi - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, memories and peripherals 32 GPIOs in QFN48 and 0.4mm pin pitch package

Çip Üzerindeki RF Sistemi - SoC 5.0 SoC w/ Flexpower ARM Cortex M0

Çip Üzerindeki RF Sistemi - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, memories and peripherals 24 GPIOs in QFN40 and 0.4mm pin pitch package

RF Mikrodenetleyiciler - MCU 32BIT MCU RX23W 512K HWQFN64 -40TO+85C

Çip Üzerindeki RF Sistemi - SoC Multi-Core BLE 5.3 SoC with Embedded FLASH

Çip Üzerindeki RF Sistemi - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOsin WL-CSP17 and 0.5mm ball pitch package