Renesas Electronics RF Entegre Devreler

Çip Üzerindeki RF Sistemi - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package

Çip Üzerindeki RF Sistemi - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOs in WL-CSP17 and 0.5mm ball pitch package

Çip Üzerindeki RF Sistemi - SoC Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols