THERM-A-GAP™ HCS10 1.0W/m-K Low Hardness Gap Pads

Parker Chomerics THERM-A-GAP™ HCS10 Gap Pads feature a low hardness of 4 Shore 00 and a thermal conductivity of 1.0W/m-K, offering a cost-effective solution for a variety of applications. These thermally conductive gap-filler pads offer excellent thermal performance and high conformability at low clamping forces. The HCS10 series is available in various thicknesses and is finished in standard sheet sizes of 9" x 9" and 18" x 18". Options include an "A" version with an aluminum foil carrier and a "G" version with a woven glass carrier. The "A" version includes a high-strength acrylic pressure-sensitive adhesive (PSA) for easy attachment to cold surfaces. Parker Chomerics THERM-A-GAP HCS10 Gap Pads provide a flexible solution for applications such as lighting, telecommunications, consumer electronics, memory modules, and automotive electronic control units (ECUs).