Winbond Featured Products

Offers an SDP or DDP and a 2 or 4 clocks architecture on the Command/Address bus.

Offers uniform 4KB sectors and dual/quad SPI inputs for 5G applications.

Offered in Single-Die-Package (SDP) and Dual-Die-Package (DDP).

Secure storage solution for systems with limited space, pins and power.

Based on the popular W25Q/W25N SpiFlash® series by stacking W25Q16JV and W25N01GV.

Consists of Serial and 1.2V NOR Flash ideal for consumer and industrial applications.

Consists of Serial NAND, High-Performance Serial NAND, and SLC NAND Flash.

Mobile and Specialty DRAM for consumer, communication, industrial, and automobile markets.

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