Altera Agilex™ 5 FPGAs & SoCs

Altera Agilex™ 5 FPGAs and SoCs serve a broad range of applications that require high performance, lower power, smaller form factors, and lower logic densities. The Agilex 5 devices feature enhanced DSP with an AI tensor block that delivers high-efficiency Artificial Intelligence (AI) and Digital Signal Processing (DSP) functionality. An asymmetric applications processor system, consisting of dual Arm^® Cortex-A76 cores and dual Cortex-A55 cores, enables performance and power efficiency optimization of workloads.

Built using Intel 7 technology, the Altera Intel Agilex 5 FPGAs offer advanced features such as a second-generation Intel® Hyperflex™ FPGA architecture, high-speed transceivers supporting up to 28.1Gbps, and PCIe 4.0 x8, DDR memory interface up to DDR5 at 4000Mbps, and general-purpose I/O from 1.05V to 3.3V. These characteristics make the devices ideal for midrange FPGA applications across the edge and core, including wireless/wireline communications, video/broadcast equipment, industrial applications, test/measurement products, medical electronics, data centers, and defense applications.

Features

Manufactured using advanced Intel technologies and processes
2nd generation Intel Hyperflex FPGA architecture enables significant design optimization to deliver up to 2.5x higher performance or up to 50% lower total power compared with Cyclone V FPGAs
Supports up to 32 x 28Gbps data rates for data-intensive applications and hardened media access control, physical coding sublayer (PCS), and forward error correction (FEC) up to 16 x 25Gbps Ethernet (GbE) for networking applications

Hardened PCI Express (PCIe) support, up to PCIe 4.0 x8 interface
Supports industry-standard DDR4, DDR5, LPDDR4, and LPDDR5
Multi-core Arm^® processors of dual-core of A55 (up to 1.5GHz) and dual-core of A76 (up to 1.8GHz)
AI Tensor Block with up to 37X1 peak theoretical TOPS improvement in INT8 operations versus Cyclone V FPGAs
MIPI D-PHY v2.5 at up to 3.54Gbps per lane

Applications

Industrial:
- AI in smart factory, edge AI
- Smart factory automation
- Sensors/motors/drives/connectivity, functional safety, and security
- I/O modules and IoT devices
- Tiny PLC and Edge AI
Medical:
- Diagnostic imaging and video
- Patient monitoring

Surveillance, retail, and consumer:
- Smart city/retail and V2X
- Trucks, bus systems, trains and railways, and EV charging vision processing
- Connectivity and video processing
- Video over IP
- Consumer electronics (AR/VR, drones, and gaming)

Specifications

D-Series - optimized for performance and power efficiency, ideal for various applications across multiple markets
- 103K to 644K LEs
- Package size as small as 23mm x 23mm
- Up to 32x 28G transceivers
- Up to PCIe 4.0 x8 and 25GbE x16 hard IP
- DDR4 at 3,200Mbps, DDR5 at 4,000Mbps, LPDDR4/4x/5 at 4,267Mbps, and QDR IV at 2,132Mbps
- Up to 56 peak TOPS INT8
- 18x19 multipliers up to 3680
- Multi-core Arm processors of dual-core A55 at 1.5GHz and dual-core A76 at 1.8GHz
- MIPI D-PHY v2.5 at up to 3.5Gbps per lane

E-Series - optimized for power and size, ideal for intelligent applications at the edge, embedded, and more
- 50K to 656K LEs
- Package size as small as 15mm x 15mm
- Up to 24x 28G transceivers
- Up to PCIe 4.0 x4 and 10/25GbE x6 hard IP
- DDR4 at 2,667Mbps, DDR5 at 3,600Mbps, and LPDDR4/5 at 3,733Mbps
- Up to 26 peak TOPS INT8
- 18x19 multipliers up to 1692
- Multi-core Arm processors of dual-core A55 at 1.5GHz and dual-core A76 at 1.8GHz
- MIPI D-PHY v2.5 at up to 3.5Gbps per lane