Amphenol FCI COM-HPC Board-to-Board Connectors
Amphenol FCI COM-HPC Board-to-Board Connectors feature a pair of 0.635mm pitch connectors with 400 pin positions. The connectors provide plug and receptacle assemblies that support 5mm and 10mm stack heights. The COM-HPC series addresses performance demands and increased bandwidth needs in server applications. The connectors deliver up to PCIe Gen5 32Gb/s SI performance and can handle Intel® Core processors. The connectors can store one terabyte of memory via eight DIMM sockets. Amphenol FCI COM-HPC Board-to-Board Connectors support a 150W max CPU power and are ideal for datacom, 5G wireless infrastructure, industrial embedded computing, medical, and military applications.
Features
- Plug and receptacle assemblies
- Supports 5mm (1016347914340T1L) and 10mm (1016347914840T1L) stack heights
- High bandwidth, up to 32Gb/s per channel
- Supports CPU power at 150W
- Stores 1TB of memory via 8 DIMM sockets
- Increased pin count
- Designed to handle Intel Core processors
- Ensures secure connection
- Withstands 100G mechanical shock
- High unmating force
- Lead free
- RoHS compliant
Applications
- Medical
- Datacom
- 5G wireless infrastructure
- Industrial embedded computing
- Military
Specifications
- Copper alloy terminal material
- Glass-filled, high-temperature resin housing
- 10μ" minimum Au on contacts over 50μ" minimum
- 1.2A current rating per contact
- 150VAC operating voltage rating
- >5000MΩ insulation resistance
- 120N maximum mating force rating
- 80N unmating force rating
- 25-cycle durability
- EIA-364-32 thermal shock rating
- EIA-364-27 mechanical shock rating
- -55°C to +125°C operating temperature range
Videos
Mechanical Drawings
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Yayınlandı: 2024-01-23
| Güncellenmiş: 2024-08-02