Infineon Technologies Automotive HybridPACK™ IGBT Modules
Infineon Technologies Automotive HybridPACK™ IGBT Modules extend across the full power spectrum required in electric and hybrid electric vehicles (EVs/HEVs). These compact modules are available in six RoHS-compliant versions with three base plate options: copper, direct cooled with ribbon bonds, and direct cooled with pin fins. The modules offer an integrated NTC temperature sensor, PressFIT contact technology, and guiding elements for easy PCB and cooler assembly. Other features include high creepage and clearance distances, high power density, and low switching losses. Applications for Infineon Automotive HybridPACK IGBT Modules include EVs, HEVs, motor drives, and commercial agriculture vehicles.
Features
- High creepage and clearance distances
- Compact design
- High power density
- Low switching losses
- Low VCE(sat)
- Low Qg and Crss
- Low inductive design
- Guiding elements for PCB and cooler assembly
- Base plate options
- Copper
- Direct cooled with ribbon bonds
- Direct cooled with pin fins
- Integrated NTC temperature sensor
- PressFIT contact technology
- UL 94V-0 module
- RoHS compliant
Applications
- EVs and HEVs
- Motor drives
- Commercial agriculture vehicles
Specifications
- 4.2kVDC 1s insulation
- 750V blocking voltage
- Short-time extended operation temperature, Tvj op = +175°C
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Yayınlandı: 2019-11-19
| Güncellenmiş: 2024-01-09