Laird Technologies Tflex™ SF16 Thermal Gap Fillers
Laird Technologies Tflex™ SF16 Thermal Gap Fillers are innovative, high-performing thermal materials in the Laird non-silicone-based gap filler portfolio. The non-silicone-based technology delivers gap fillers with excellent deflection properties, minimizing pressure on components during deflection. Little pressure is required to achieve very low thermal resistance. The thickness of the Tflex SF16 ranges from 0.5mm to 5mm in 0.5mm increments, available as standard.
Features
- Non-silicone formulation
- Exceptionally low thermal resistance
- Low peak and residual pressure
- Excellent surface wetting for low contact resistance
- Thermoplastic matrix softens with application heat, further lowering contact resistance
- Naturally tacky surfaces
- Environmentally friendly solution that meets regulatory requirements, including RoHS and REACH
Applications
- Filling air gaps between heat‑generating components and heat sinks
- Thermal management of PCBs in electronic assemblies
- Cooling of power supplies, converters, and inverters
- Heat dissipation for CPUs, graphics processing units (GPUs), and application-specific ICs (ASICs)
- Telecommunications and networking equipment
Specifications
- 0.5mm to 5mm thickness
- 3.09g/cc density
- -40°C to +125°C operating temperature range
- 0.220% outgassing CVCM
- 0.600% outgassing TML
- 16.00W/mK thermal conductivity
- 40 hardness (Shore 00)
Additional Resources
Yayınlandı: 2026-02-06
| Güncellenmiş: 2026-02-12