Laird Technologies Tpcm™ 7000 High-Performance TIMs
Laird Technologies Tpcm™ 7000 High-Performance Thermal Interface Material (TIM) enhances the cooling of the rigorous thermal challenges in electronics. These TIMs feature a thermal conductivity of 7.5W/mK and provide the lowest thermal resistance by coupling with superior wetting of the mating surfaces and displacing air. Other features are a non-silicone formulation that provides a naturally tacky surface, -40°C to +125°C operating temperature range, and long-term reliability. Within a temperature range of +50°C to +70°C, the initial pad thickness can decrease to a bondline as thin as 35µm. Laird Tpcm 7000 TIMs reliability is shown through exposure to 2000hrs of various aging tests, resulting in proven dependability of +150°C operating temperature. Typical applications include graphic cards, desktops, servers, IGBTs, automotive, memory modules, and game consoles.Features
- 7.5W/mK bulk thermal conductivity
- Easy application and automation
- Non-silicone formulation that provides a naturally tacky surface
- An environmentally friendly solution that meets regulatory requirements
- Bondline as thin as 35µm once softened (+50°C to +70°C)
- Easy rework
- No pump-out
- Long-term reliability
- Fully characterized long-term reliability
- Environmentally friendly solution
- RoHS and REACH compliant
Applications
- Graphics card
- Desktops
- Servers
- IGBTs
- Automotive
- Memory modules
- Game consoles
Specifications
- Temperature ranges
- -40°C to +125°C operating
- +50°C to +70°C softening
- 35µm minimum bondline thickness
- 0.13mm, 0.2mm, 0.25mm, and 0.4mm thickness options
- 31.54 dielectric constant at 1MHz
- 5.4x1015Ω-cm volume resistivity
- 7.5W/m-K bulk thermal conductivity
- 2.5g/cc density
- 1-year shelf life from date of shipment in a sealed bag
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Yayınlandı: 2022-07-29
| Güncellenmiş: 2025-06-17
