Renesas / Dialog DA14592 SmartBond™ BLE SoC with Embedded Flash
Renesas/Dialog DA14592 SmartBond™ Multi-Core BLUETOOTH® Low-Energy (BLE) 5.2 or 5.3 System-on-Chip (SoC) with Embedded Flash features CM33F at 64MHz as application core and CM0+ at 64MHz as configurable MAC. This multi-core BLE SoC also features a quad-decoder (active in hibernation) and 8-channel sigma-delta ADC with 15 Effective Number of Bits (ENOB). The DA14592 SoC offers high-precision analog measurements and M33 + M0 Arm® Cortex® cores that support floating-point application programming. This SoC allows the expansion of memory with QSPI external Flash/RAM. Typical applications include asset tracking, data logger, human interface device, activity tracker, high-end voice RCU, and crowd-sourced locations.
The DA14592 offers low overall radio power consumption and a low-power mode with a radio transmit current of only 2.3mA at 0dBm and a radio receive current of 1.2mA. Furthermore, it supports an ultra-low hibernation current of 90nA, which extends the shelf-life of end-products shipped with a connected battery. For products that require extensive application processing, it also boasts an ultra-low active current of 34µA/MHz. The DA14592 has BLE 5.2, while the DA14594 has BLE 5.3.
The Renesas DA14592 SoC typically requires only six external components, delivering best-in-class eBOM and offering a low solution cost and size. Its high-accuracy on-chip RCX removes the need for an external, sleep mode crystal, with most applications only requiring a 32MHz crystal. Package options include WLCSP (3.32mm x 2.48mm) and FCQFN (5.1mm x 4.3mm), which offer an attractively small solution footprint.
Features
- Multi-core
- CM33F @64MHz as application core
- CM0+@64MHz as configurable MAC
- 96kB RAM (16kB Cache), 256kB Flash, 288kB ROM, and QSPI external Flash/RAM expansion
- 8-channel sigma-delta ADC with 15 ENOB
- Power consumption
- Receiver = 2.6mA
- Transmitter = 3.5mA
- Active = 34μA/MHz
- Hibernation = 75nA
- Quad-decoder (active in hibernation)
- M33 dedicated to apps, M0+ for BLE
- High-precision analog measurements
- OTP key storage and secure boot
- Requires six external components
- Advantages of BLE 5.3
- Enhanced efficiency and connection management
- Better connection stability, reduced power consumption, and improved interference management through channel classification
- Reduced power consumption through connection subrating
- Improved stability in crowded wireless environments
- Available in WLCSP (3.32mm x 2.48mm) or FCQFN (5.1mm x 4.3mm) package
Applications
- Crowd-sourced locations
- Google FMD
- Apple FindMy (reference designs)
- Asset tracking
- Connected health
- Human interface device
- Activity tracker
- Data logger
- PoS reader
- Metering
- High-end voice RCU
- IoT end node
Videos
Block Diagram
Additional Resources
Related Products
Renesas / Dialog DA14592MOD Bluetooth® Low-Energy (BLE) Modules
Include all external components required to implement a BLE solution and feature a quad-decoder.
Renesas Electronics DA14594 SmartBond Dual-Core BLUETOOTH® LE 5.3 SoC
A dual-core wireless MCU that combines the current Arm® Cortex®-M33™ application processor.
Development Tools
Renesas / Dialog DA14592 Development Tools
Offer comprehensive and user-friendly development environment with real-time power profiling.
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