Euro Incoterms:FCA (Nakliye Noktası) Gümrük vergisi, gümrük ücretleri ve vergiler teslimat sırasında tahsil edilir.
ABD Doları Incoterms:FCA (Nakliye Noktası) Gümrük vergisi, gümrük ücretleri ve vergiler teslimat sırasında tahsil edilir.
Resimler sadece referans içindir Ürün Teknik Özelliklerine Bakın
Bunu Paylaş
Bağlantı şu anda oluşturulamıyor. Lütfen tekrar deneyin.
3300V & 2300V Silicon Carbide (SiC) MOSFETs
Navitas Semiconductor 3300V and 2300V Silicon Carbide (SiC) MOSFETs are based on the latest GeneSiC™ trench-assisted planar (TAP) technology and feature flexible packaging formats, including power module, discrete, and known good die (KGD). For high-power density and high-reliability systems, the MOSFETs are integrated into an advanced SiCPAK™ G+ power module package, in half-bridge and full-bridge circuit configurations. The proprietary TAP SiC MOSFET technology offers improved performance, reliability, and avalanche robustness. The TAP architecture performs a multi-step e-field management profile to significantly reduce voltage stress and improve voltage blocking capabilities compared to trench and traditional-planar SiC MOSFETs. Navitas 3300V and 2300V SiC MOSFETs are ideal for AI data centers, grid and energy infrastructure, and industrial electrification, including energy storage, renewable, and megawatt-scale fast-charging applications.