5591-25

3M Electronic Specialty
517-5591-25
5591-25

Ürt.:

Açıklama:
Termal Arayüz Ürünleri WX300901310 3M(TM) THERMALLY COND INTERFACE PAD 5591, 210MM X 300MM 2.5MM

ECAD Modeli:
Bu dosyayı ECAD Aracınız için dönüştürmek için ücretsiz Library Loader dosyasını indirin. ECAD Model hakkında daha fazla bilgi edinin.

Stokta Var: 106

Stok:
106 Hemen Gönderilebilir
Minimum: 1   Çoklu: 1
Birim Fiyat:
-,-- €
Toplam Fiyat:
-,-- €
Tahmini Gümrük Vergisi:

Fiyatlandırma (EUR)

Miktar Birim Fiyat
Toplam Fiyat
28,98 € 28,98 €
27,01 € 270,10 €
25,34 € 506,80 €
24,79 € 1.239,50 €
23,89 € 2.389,00 €
22,66 € 4.532,00 €

Ürün Niteliği Öznitelik Değeri Özellik Seçin
3M
Ürün Kategorisi: Termal Arayüz Ürünleri
Gap Fillers / Gap Pads / Sheets
Thermally Conductive Tape
Non-standard
Silicone Elastomer
1 W/m-K
White
- 50 C
+ 125 C
210 mm
300 mm
2.5 mm
UL 94 V-0
5591
Marka: 3M Electronic Specialty
Ürün Tipi: Thermal Interface Products
Fabrika Paket Miktarı: 10
Alt kategori:: Thermal Management
Parça No Takma Adları: 5591 08806080063735 7010321481
Birim Ağırlık: 284,634 g
Bulunan ürünler:
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Bu kategorideki benzer ürünleri göstermek için yukarıda en az bir onay kutusu seçin.
Seçilen özellikler: 0

CNHTS:
3824999999
USHTS:
3506911000
ECCN:
EAR99

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.

Thermally Conductive Adhesive Tapes

3M™ Thermally Conductive Tapes offer a wide range that can be used in various thermal interface solutions, including cushion gasket tape, XYZ-axis thermally conductive tape, double-sided tape, adhesive transfer tape, and water contact indicator tape variants. These thin, highly conformable thermal interfaces and heat-spreading tapes provide high adhesion and excellent thermal conductivity. The tapes apply quickly and easily. A good dielectric strength makes these tapes appropriate for applications, including bonding heat sinks, heat spreaders, and other cooling devices to the IC packages, power transistors, and other heat-generating components.

Thermal Interface Solutions

3M™ Thermal Interface Solutions includes electrically conductive transfer tapes and conductive interface pads. The electrically conductive tapes are a wide range that can be used in various thermal interface solutions. Thermally conductive silicone interface pads are designed to provide a heat transfer path between heat-generating components, heat sinks, and other cooling devices.