Amphenol FCI BergStik® 2.54mm Unshrouded Headers

Amphenol FCI (Amphenol ICC) BergStik^® 2.54mm Pitch Unshrouded Headers provide board-to-board and mezzanine, header and wire housing, power-to-board, and memory card interconnect solutions for a wide variety of electronic equipment and devices. BergStik connectors feature a breakaway design, allowing users to cut or break to length to suit an application profile. The maximum current rating of these Amphenol FCI (Amphenol ICC) unshrouded headers is 3A per contact. These single- and double-row connectors include straight or right-angle options from 2 to 72 positions.

Features

High-temperature thermoplastic material, reflow compatible
Variable spacing height for stacking headers
Allows dual entry with mating from top or bottom, suitable for mezzanine application and gives more flexibility in meeting different stack height requirements
Blank 0.64mm square contacts present four surfaces of equal quality, suitable for wire wrapping
Standoff design allows cleaning to remove soldering contamination

Duplex plating is cost-effective
Tin-lead plating in the press-fit area allows easy pin insertion onto the PCB
Retention legs option provides high retention force onto the PCB
Press-fit designed to fit 1.02mm diameter hole, solder-to-board product, same layout on THT and press-fit
Meets DIN 41651 specification, HE13, and BT D2632