Infineon Technologies Intuitive Sensing Technology

Infineon Technologies Intuitive Sensing Technology enables simple, effortless user interactions with all kinds of smart devices. Bridging the gap between the real and digital worlds, Intuitive Sensing Technology is developed to make life easier, safer, greener, and more efficient. The essential value of sensor technology lies in making customer lives more convenient through seamless, natural interactions between people and sensing devices, leaving users free to focus on what matters in life.

Infineon XENSIV™ Sensors and REAL3™ Time-of-Flight Sensors allow smart devices and robots to see, hear, feel, and intuitively “understand” their surroundings. The sensing capabilities enable humans to interact with smart devices more naturally and seamlessly. These intuitive sensing innovations slowly blur the lines between humans and smart devices. Thanks to industry-leading technologies, the precise sensors are a perfect fit for various customer applications in automotive, industrial, and consumer markets.

Applications

Smart buildings
Smart homes
Smart speakers
Lighting

Wearables
Smart devices like refridgerators, smartphones, alarm systems, and light control used in any kind of home/consumer application

Intuitive Sensing

Components

XENSIV pressure sensors enable "things" to feel by measuring barometric pressure and temperature to accurately detect altitude and airflow.
- Small form factors to facilitate system integration
- High precision and relative accuracy over a wide temperature range
- Fast read-out speeds via the serial I²C/SPI interface
- Low power consumption ensures longer battery lifetimes
- FIFO buffer that can store the last 32x measurements
The XENSIV radar sensors enable "things" to see by sensing distance, speed, direction of movement, and sub-millimeter motions. Offers both FMCW and Doppler radar sensors supporting 24GHz, 60GHz, and 77/79GHz.
- Direction, proximity, and speed detection
- Segmentation and tracking functionalities
- Target positioning
- Detection through non-conductive materials
- Product design flexibility
- Anonymous sensing
- Maintains operation through harsh environmental conditions such as rain, snow, fog, dust, etc.
- Sensitive enough to capture breathing and heartbeat, radar can feel presence and vital functions
- Radar performance parameters can be adjusted, adaptable to different application requirements
XENSIV environmental sensors allow "things" to smell by detecting gas concentrations for indoor and outdoor air quality monitoring. The XENSIV PAS CO₂ integrates (on the PCB) a photoacoustic (PAS) transducer, including a detector, infrared source, and optical filter; a microcontroller for signal processing and algorithms; and a MOSFET chip to drive the infrared source.
- Exceptionally small form factor (14mm x 13.8mm x 7.5mm)
- Accurate and robust performance at ppm level (±30ppm ±3% of reading)
- SMD package delivered in tape and reel
- Advanced compensation and self-calibration algorithms
- Various configuration options (e.g. sampling rate, baseline calibration) and interfaces (UART, I²C, PWM)
- High-quality data and compliance with smart building standards
- Plug and play for fast design-to-market

XENSIV MEMS microphones give "smart ears" to audio and voice-controlled devices, making communication more natural and intuitive.
- Low-noise capturing of the faintest sounds
- Enables best-in-class transparent hearing and active noise-cancelling functionality
- Low signal distortions even at high sound pressure levels
- Handling of high signal peaks for reliable ANC performance
- Integrated ingress protection and filters for RF suppression ensure stable performance in challenging environments
- Selectable power modes for long-lasting battery life
- Better manufacturability and performance with low group delay for multi-mic applications
- High qualification standards and 100% test coverage during manufacturing
REAL3 ToF 3D image sensors create a 3D map of objects, rooms, and people in real-time. These single-chip imagers are sunlight-robust, highly scalable, and ready for integration into a wide range of consumer, automotive, and industrial applications.
- Holistic offer including depth algorithm and volume production setup
- Provides robust performance under all environmental conditions
- Enables miniaturized designs
- Optimizes BoM and part counting
- Accelerates time-to-market